Using a Diode Laser to Uncover Dental Implants in Second-stage Surgery

Overview

Journal Gen Dent

Specialty Dentistry

Date 2005 Dec 22

PMID 16366049

Citations 11

Authors

Sam Yeh

Kamlesh Jain

Sebastiano Andreana

Affiliations

Soon will be listed here.

Abstract

A soft tissue diode laser offers an alternative technique for uncovering dental implants. This article presents two cases in which four dental implants were uncovered using a soft tissue laser. This technique provides an efficient and patient-friendly method to perform second-stage implant surgery, safely allowing a faster rehabilitative phase.

Citing Articles

A Comparative Study of Mid-Crestal Incision and Diode Laser Shaped Incision to Assess Papilla Level in Second Stage Dental Implant Surgery.

Parihar A, Manas A, Gopinath P, Ahmed M, Mathar M, Chauhan M J Pharm Bioallied Sci. 2022; 14(Suppl 1):S236-S238.

PMID: 36110672 PMC: 9469255. DOI: 10.4103/jpbs.jpbs_115_22.

Comparison of clinical efficacy of diode laser and erbium, chromium: Yttrium, scandium, gallium, and garnet for implant stage 2 recovery procedure - A randomized control clinical study.

Selvaganesh S, Gajendran P, Nesappan T, Rajendra Prabhu A J Indian Soc Periodontol. 2021; 25(4):335-340.

PMID: 34393405 PMC: 8336765. DOI: 10.4103/jisp.jisp_448_20.

Evaluation of papilla levels following three different techniques for the second stage of implants - A clinical and radiographic study.

Kamakshi L, Uppoor A, Nayak D, Pralhad S J Indian Soc Periodontol. 2021; 25(2):120-127.

PMID: 33888943 PMC: 8041085. DOI: 10.4103/jisp.jisp_60_20.

Preservation of keratinized gingiva around dental implants using a diode laser when uncovering implants for second stage surgery.

Al-Delayme R Eur Oral Res. 2019; 53(3):106-112.

PMID: 31579890 PMC: 6761491. DOI: 10.26650/eor.20190022.

Clinical comparison of the use of ER,CR:YSGG and diode lasers in second stage implants surgery.

Tunc S, Yayli N, Talmac A, Feslihan E, Akbal D Saudi Med J. 2019; 40(5):490-498.

PMID: 31056627 PMC: 6535160. DOI: 10.15537/smj.2019.5.24105.