Nien-Ti Tsou
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Explore the profile of Nien-Ti Tsou including associated specialties, affiliations and a list of published articles.
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23
Citations
68
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Recent Articles
1.
Chen J, Wei Y, Lo H, Lu S, Chen Y, Lei C, et al.
ACS Appl Mater Interfaces
. 2023 Sep;
15(40):47715-47724.
PMID: 37769228
Quasi van der Waals epitaxy is an approach to constructing the combination of 2D and 3D materials. Here, we quantify and discuss the 2D/3D interface structure and the corresponding features...
2.
Kung P, Heydari M, Tsou N, Tai B
Comput Methods Programs Biomed
. 2023 Apr;
235:107524.
PMID: 37060686
Background And Objective: Heat generation and associated temperature rise in surgical drilling can cause irreversible tissue damage. It is nearly impossible to provide immediate temperature prediction for a hand-held drilling...
3.
Kung P, Hsu C, Yang A, Chen N, Tsou N
Int J Mol Sci
. 2023 Feb;
24(3).
PMID: 36768272
Tissue differentiation varies based on patients' conditions, such as occlusal force and bone properties. Thus, the design of the implants needs to take these conditions into account to improve osseointegration....
4.
Tsuang F, Li M, Chu P, Tsou N, Sun J
J Orthop Surg Res
. 2023 Jan;
18(1):71.
PMID: 36717827
Background: Degenerative disc disease is one of the most common ailments severely affecting the quality of life in elderly population. Cervical intervertebral body fusion devices are utilized to provide stability...
5.
Lee J, Wang P, Lo K, Shen P, Tsou N, Kakehi K, et al.
Sci Technol Adv Mater
. 2023 Jan;
24(1):2158043.
PMID: 36684848
In this study, tensile and creep deformation of a high-entropy alloy processed by selective laser melting (SLM) has been investigated; hot ductility drop was identified at first, and the loss...
6.
Hsu P, Lee D, Tran D, Shie K, Tsou N, Chen C
Materials (Basel)
. 2022 Oct;
15(20).
PMID: 36295180
In this study, symmetrical solder joints (Cu/Ni/SnAg/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 × 10 A/cm) or low (1.6 × 10 A/cm) current densities. Failures in the...
7.
Ong J, Tran D, Lan M, Shie K, Hsu P, Tsou N, et al.
Sci Rep
. 2022 Jul;
12(1):13116.
PMID: 35907932
Cu-Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests. In this study, Cu-Cu...
8.
Hsu P, Shie K, Tran D, Tsou N, Chen C
Materials (Basel)
. 2022 Jul;
15(14).
PMID: 35888410
In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO) were employed to seal the joints. Stress gradients induced...
9.
Hsu P, Shie K, Chen K, Tu J, Wu C, Tsou N, et al.
Sci Rep
. 2022 Apr;
12(1):6711.
PMID: 35468910
Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore's law of minimization in 2D IC. However, the reliability of 3D IC,...
10.
Chu C, Wu P, Chen J, Tsou N, Lin Y, Lo Y, et al.
Adv Healthc Mater
. 2021 Dec;
11(11):e2101310.
PMID: 34971080
A remote optogenetic device for analyzing freely moving animals has attracted extensive attention in optogenetic engineering. In particular, for peripheral nerve regions, a flexible device is needed to endure the...