Correlation Between Surface Scaling Behavior and Surface Plasmon Resonance Properties of Semitransparent Nanostructured Cu Thin Films Deposited PLD

The surface scaling behavior of nanostructured Cu thin films, grown on glass substrates by the pulsed laser deposition technique, as a function of the deposition time has been studied using height-height correlation function analysis from atomic force microscopy (AFM) images. The scaling exponents , , / and of the films were determined from AFM images. The local roughness exponent, , was found to be ∼0.86 in the early stage of growth of Cu films deposited for 10 minutes while it increased to 0.95 with a longer time of deposition of 20 minutes and beyond this, it was nearly constant. Interface width (rms roughness) scales with depositing time () as ∼ , with the value of the growth exponent, , of 1.07 ± 0.11 and lateral correlation length following = and the value of / = 0.70 ± 0.10. These exponent values convey that the growth dynamics of PLD Cu films can be best described by a combination of local and non-local models under a shadowing mechanism and under highly sticking substrate conditions. From the scaling exponents and power spectral density function, it is concluded that the films follow a mound like growth mechanism which becomes prominent at longer deposition times. All the Cu films exhibited SPR properties where the SPR peak shifts towards red with increasing correlation length () whereas bandwidth increases initially with and thereafter decreases gradually with .