Simultaneously Enhanced Dielectric Properties and Through-plane Thermal Conductivity of Epoxy Composites with Alumina and Boron Nitride Nanosheets

Overview

Journal Sci Rep

Specialty Science

Date 2021 Jan 29

PMID 33510309

Citations 18

Authors

Zhengdong Wang

Guodong Meng

Liangliang Wang

Liliang Tian

Siyu Chen

Guanglei Wu

Bo Kong

Yonghong Cheng

Affiliations

Soon will be listed here.

Abstract

Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.

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