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Effect of Fiber Surface Modification on the Interfacial Adhesion and Thermo-Mechanical Performance of Unidirectional Epoxy-Based Composites Reinforced with Bamboo Fibers

Overview
Journal Molecules
Publisher MDPI
Specialty Biology
Date 2019 Jul 27
PMID 31344801
Citations 8
Authors
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Abstract

In this work, bamboo fibers are chemically modified with NaOH solution of 1, 4, and 7 wt% concentrations at room temperature, respectively, and subsequently the untreated and treated fibers are prepared with epoxy resin for unidirectional composites by hot pressing molding technique. Tensile and micro-bond tests are conducted on the composite specimens to obtain mechanical properties, such as tensile strength and modulus, elongation at break, and interfacial strength. Besides, scanning electron microscopy (SEM) is employed to perform morphological observations for constituent damages. In addition, the influence of alkali concentration on the thermal performance of epoxy-based composites is examined by using differential scanning calorimetry (DSC) and thermogravimetric (TG) analysis. It is found that composite tensile strength reaches the maximum when the alkali concentration is 4%, increased by 45.24% compared with untreated composites. The composite elongation at break increases on increasing the concentration. Inversely, the composite modulus decreases as the concentration increases. Besides, the results demonstrate that the chemical treatment on the fiber surface could improve interface adhesion, as observed from its topography by SEM. Micro-bond test reveals that there is maximum interfacial shear strength when the alkali concentration is 4%, which increases by 100.30% in comparison with the untreated samples. In case of thermal properties, the DSC analysis indicates that the glass transition temperature is maximized at 4% alkali concentration, which is increased by 12.95%, compared to those from unmodified fibers. In addition, TG results show that the 4% concentration also facilitates thermal stability improvement, indicative of superior interfacial bonding.

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