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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Overview
Journal Sensors (Basel)
Publisher MDPI
Specialty Biotechnology
Date 2018 Jun 24
PMID 29933589
Citations 14
Authors
Pouria Aryan
Santhakumar Sampath
Hoon Sohn
Affiliations
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Abstract

The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.

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